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ABOUT ENVICOOL NEWS The First Dual-Sided All-Area Liquid Cold Plate Server Released, Featuring Envicool High-Performance Cold Plates
Company News / 2025-11-18
The First Dual-Sided All-Area Liquid Cold Plate Server Released, Featuring Envicool High-Performance Cold Plates

On November 19, the first dual-sided full-area liquid cold plate server was officially unveiled at Intel Connection 2025 in Chongqing, China.

 

This groundbreaking solution—jointly developed by Intel, Envicool, H3C, Union Memory, and a leading Chinese memory manufacturer—features a fully China-made memory architecture. It significantly enhances system reliability while reducing energy consumption and O&M costs, setting a new benchmark for green data centers.

 

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The first dual-sided full-area liquid cold plate server was officially unveiled at Intel Connection 2025


At the launch ceremony, Wang Tiewang, Vice President of Envicool, remarked: “The creation of this product is the result of deep collaboration among all partners. Through the closed loop of technology, ecosystem, and scenarios, this dual-sided full-area liquid cold plate server is now capable of meeting the demands of AI training and high-throughput computing (HTC), while also achieving true readiness for large-scale deployment. Envicool will continue to invest in R&D to help global data centers unify ‘high-efficiency computing power’ with ‘ultra-low PUE’.”

 

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Wang Tiewang, Vice President of Envicool, made a speech on the launch ceremony


Envicool’s advanced liquid cold plate solution enables 100% liquid cooling coverage for all major server heat sources—including CPU, memory, and SSD with a total heat dissipation capacity exceeding 2 kW.This eliminates system hotspots and fully meets the cooling requirements of the Intel® Xeon® 6 platform with TDP levels up to 650W, ensuring stable all-core turbo performance.

 

For the ultra-tight 0.297-inch memory pitch, Envicool developed a dedicated high-performance cold plate for DDR5 6400MT/s memory. The dual-sided liquid cooling design ensures that memory temperatures remain within specification even under demanding inlet temperatures and full-load operation.With a modular architecture, this solution offers excellent scalability and versatility, improving both system reliability and deployment flexibility.

 

In addition, Envicool also engineered a purpose-built SSD cold plate, enabling precise thermal control for hard drives, NAND, and cache components under high-density hot-swap conditions—providing end-to-end reliability from compute cores to digital storage.

 

At Intel Connection 2025, Envicool also showcased its pumped two-phase cold plate liquid cooling system, coolant testing platform with a single-phase cold plate liquid cooling system , and UQD interlocking demo.

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