Liquid Cooling & Electronics Cooling

In recent years, with the continuous development of microelectronics and optoelectronics in the direction of high performance and high integration, the power consumption of electronic chips has increased day by day. The heat dissipation problem of components has become increasingly prominent.
High Reliability
High Energy Efficiency
Intelligent Mangement

application scenarios

01
Liquid Cooling
02
Electronics Cooling
Envicool 3D-TVC zero-power phase change liquid cooling solution adopts the latest generation of three-dimensional thermodynamic circulation technology, uses the principle of thermosiphon, replaces the capillary structure of the VC plate with a vacuum chamber, and uses gravity to complete the phase change cycle of the working medium, minimizing heat loss. resistance to achieve efficient heat conduction. The integrated three-dimensional aluminum vacuum structure eliminates the traditional copper die-cast heat sink, strengthens natural convection to achieve efficient heat dissipation, and takes into account the goals of strong heat dissipation, small size, and light weight.